Complex strain paths in polycrystalline copper: microstructural aspects

Materials Research. 1999;2(3):185-189 DOI 10.1590/S1516-14391999000300012

 

Journal Homepage

Journal Title: Materials Research

ISSN: 1516-1439 (Print)

Publisher: Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)

LCC Subject Category: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials

Country of publisher: Brazil

Language of fulltext: English

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AUTHORS

M.F. Vieira
J.V. Fernandes

EDITORIAL INFORMATION

Peer review

Editorial Board

Instructions for authors

Time From Submission to Publication: 36 weeks

 

Abstract | Full Text

Microstructural aspects of polycrystalline copper sheets subjected to complex strain paths were analysed in this work. Dislocation structures developed during the strain paths (rolling and tension) and the evolution of this microstructure during reloading have been studied. The active slip systems developed in each strain path were used to explain the microstructural evolution. The heterogeneous surface deformation observed on polished tensile specimens prestrained in rolling was also analysed. The structural aspects are related with the mechanical behaviour of the material, namely with the increase in yield stress in reloading, the work hardening evolution and the premature occurrence of plastic instability for some prestrain values.