Temperature and Wear Analysis of Adhesively Bonded and Soldered Cutting Tools for Woodcutting

Abstract

Cutting tools undergo constant development to meet the demands of higher cutting speeds, difficult-to-cut materials and ecological considerations. One way to improve cutting tools involves transitioning from soldering to adhesive bonding in the manufacturing process. However, there is limited research comparing adhesively bonded tools with soldered tools in woodcutting applications. This paper presents a comparison between adhesively bonded and soldered tools in the cutting of medium-density fiberboards over a cutting distance of 1000 m. The results indicate that adhesively bonded tools are well-suited for machining medium-density fiberboards. Additionally, the cutting-edge radii exhibit a slower increase and the tool temperatures are higher compared to soldered tools. Future research could optimize the damping effect through the precise design of the bonding area. Additionally, investigating a cooling concept for the machining process could help minimize ageing effects.

Keywords

• adhesive bonding
• milling tools
• woodcutting