Hot Deformation Behavior of SiC_P/A1-Cu Composite

Abstract

Using the Gleeble-1500D simulator, the high temperature plastic deformation behavior of SiCp/Al-Cu composite were investigated at 350-500℃ with the strain rate of 0.01-10s-1. The true stress-strain curves were obtained in the tests. Constitutive equation and processing map were established. The results show that the softening mechanism of dynamic recrystallization is a feature of high-temperature flow stress-strain curves of SiCp/A1-Cu composite, and the peak stress increases with the decrease of deformation temperature or the increase of strain rate.The flow stress behavior of the composite during hot compression deformation can be represented by a Zener-Hollomon parameter in the hyperbolic sine form. Its activation energy for hot deformation Q is 320.79kJ/mol. The stable regions and the instability regions in the processing map were identified and the microstructures in different regions of processing map were studied.There are particle breakage and void in the instability regions.

Keywords

• SiC_p/Al-Cu composite
• hot deformation
• stress-strain curve
• constitutive equation
• processing map
• microstructure