A 60 GHz Millimeter-Wave Antenna Array for 3D Antenna-in-Package Applications

Abstract

This paper presents a 60 GHz millimeter-wave (mm-wave) antenna array using standard printed circuit board (PCB) for 3D Antenna-in-package (AiP) implementation. The array consists of a 4 microstrip patch elements, differentially fed with an open stub matching feed network to enable 3D integration. The $1\times 4$ finite antenna array with ball grid array (BGA) and silicon (Si) interposer operates from 58.46 to 62.14 GHz with 3.6 GHz instantaneous bandwidth, low mutual coupling of about <−25 dB and achieves a realized gain of about 10.51 dBi. The array is capable of scanning down to ±45° and provides low cross polarization levels of −40 dB. The fabricated multilayer $1\times 4$ array consists of two substrates and one bondply layer with antennas, via-to-open stub matching network, and a differential to single-ended corporate feed network for the measurement. A prototype with a differential to single-ended corporate feed network was fabricated and tested showing a gain of about 10.02 dBi at the operating frequency with $\geq 90$ % radiation efficiency. Such a gain and efficiency make the presented design a leading candidate for 3D AiP applications.

Keywords

• Antenna arrays
• electronics packaging
• millimeter-wave communication
• PCB
• system integration
• 60 GHz