CPU Performance Improvement Using Novel Thermally Conductive Carbon Nano Grease

Abstract

Electronics depend on their ability to shed operational heat to maintain operating temperature. Inferior grease can create preventable problems in electronics. This is typically achieved through a thermal grease or paste. If this grease fails to dissipate heat or maintain thermal contact, then the equipment will have faults. Greases with less-than-optimal performance create excessive wear, heat, and reduced life expectancy. This can cause equipment failures and malfunctions at the most inopportune moments. Thermal greases are applied to Central Processors (CPU) and Graphics Processors (GPU) in avionics LRUs, computers, Solar panels, HVAC systems, and other electronics. A high-performance novel nano grease will shed excess heat and increase device life expectancy. The fabricated nano greases show improvements of up to 80% in thermal conductivity measurements. CPU testing resulted in a 100% decrease in the standard deviation of temperature variation from commercial greases.

Keywords

• carbon nano grease
• hydrogen bonding
• thermal conductivity
• boron nitride