A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu; L. Pu; Y. Yang; Q. He; Z. Zhou; C. Tan; X. Zhao; Q. Zhang; K.N. Tu

Materials Today Advances (Sep 2020)

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu,
L. Pu,
Y. Yang,
Q. He,
Z. Zhou,
C. Tan,
X. Zhao,
Q. Zhang,
K.N. Tu

Affiliations

Y. Liu: Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China; Corresponding author.
L. Pu: Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
Y. Yang: Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China; Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China; Corresponding author.
Q. He: Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China
Z. Zhou: Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China
C. Tan: Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
X. Zhao: Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
Q. Zhang: Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
K.N. Tu: Department of Materials Science and Engineering, University of California, Los Angeles, USA

Journal volume & issue: Vol. 7
p. 100101

Abstract

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SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

Published in Materials Today Advances

ISSN: 2590-0498 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-today-advances

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