Design for EMI/ESD Immunity for Flexible and Wearable Electronics

Zijin Pan; Xunyu Li; Weiquan Hao; Runyu Miao; Albert Wang

doi:10.1109/JEDS.2023.3250356

IEEE Journal of the Electron Devices Society (Jan 2023)

Design for EMI/ESD Immunity for Flexible and Wearable Electronics

Zijin Pan,
Xunyu Li,
Weiquan Hao,
Runyu Miao,
Albert Wang

Affiliations

Zijin Pan: ORCiD; Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA
Xunyu Li: Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA
Weiquan Hao: Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA
Runyu Miao: Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA
Albert Wang: ORCiD; Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA

DOI: https://doi.org/10.1109/JEDS.2023.3250356
Journal volume & issue: Vol. 11
pp. 700 – 707

Abstract

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Proliferation of flexible, wearable and portable electronics come with new challenges of system reliability. Particularly, flexible and wearable electronics cause more frequent and are more susceptible to electromagnetic interference (EMI) effects and electrostatic discharge (ESD) failures, and have unique requirements for design-for-reliability (DfR) associated with EMI and ESD immunity to achieve electromagnetic compatibility (EMC) compliance. This paper outlines the key challenges in design for EMI and ESD immunity for wearable microsystems and discusses potential design for EMI/ESD immunity solutions.

Published in IEEE Journal of the Electron Devices Society

ISSN: 2168-6734 (Online)
Publisher: IEEE
Country of publisher: United States
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering
Website: https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6245494

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Abstract

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