Current Research in Food Science (Jan 2022)

Loss factor and moisture diffusivity property estimation of lentil crop during microwave processing

  • Mohamad Mehdi Heydari,
  • Tahereh Najib,
  • Oon-Doo Baik,
  • Kaiyang Tu,
  • Venkatesh Meda

Journal volume & issue
Vol. 5
pp. 73 – 83

Abstract

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Characterization of loss factor and moisture diffusivity are required to understand materials' precise behavior during microwave processing. However, providing the processing facilities to measure these properties in a real or simulated situation directly can be complicated or unachievable. Hence, this study proposes an alternative procedure for modeling these properties according to their affecting factors including temperature, and moisture content. The basis of this method is to use an algorithm that combines the optimization approach and the numerical solution of the heat and mass transfer governing equations, including boundary conditions. For this aim, the coefficients of estimated models for loss factor and moisture diffusivity were obtained by minimizing the sum square error of the experimentally measured mean surface temperature and moisture content and the predicted values by solving the system of partial differential equations. The suggested models illustrated that during the microwave process, the moisture diffusivity grows arithmetically, and the loss factor generally raises, but transition points were observed in the trend for the samples tempered up to the 50% moisture content. These points have been attributed to the starch gelatinization and confirm how the bio-chemical reaction would have a noticeable effect on this property, determining the microwave energy absorbance. The results of differential scanning calorimetry thermograms and the Fourier transform mid-infrared spectra of flours obtained from microwave processed lentil seeds also confirmed the greatest intensity of starch structure alteration happened for the samples tempered to 50% moisture content by showing the highest shifts in the endothermic peak and lowest degree of order.

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