Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling
Yubo Zhang,
Jiaming Liu,
Ying Fu,
Jinchuan Jie,
Yiping Lu,
Qingtao Guo,
Tongmin Wang,
Tingju Li
Affiliations
Yubo Zhang
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Jiaming Liu
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Ying Fu
Engineering Institute, Bohai University, Jinzhou 121001, China
Jinchuan Jie
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Yiping Lu
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Qingtao Guo
State Key Laboratory of Metal Material for Marine Equipment and Application, Anshan 114000, China
Tongmin Wang
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Tingju Li
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
In the present work, Cu-Pb-Sn and Q235 laminated composite were fabricated by a horizontal semisolid rolling procedure. The interfacial structure, elemental distribution, and properties of the composite were investigated. Finite-element simulation was conducted to analyze the temperature field and solidification process during the semisolid rolling. An appropriate semi-solid region was observed at a pouring temperature of 1598 K in the simulation, which would effectively kept fluidity and avoided casting defects. The experimental results showed that good interface between Cu-Pb-Sn alloy and Q235 steel was achieved by the proposed process at 1598 K, without casting defects or excessive deformation. The Cu and Fe alloys were bonded mainly by the diffusion of Fe into Cu matrix, and a handful of microscopic Pb-rich layer. Fine Pb-rich precipitates were uniformly distributed in the Cu-Pb-Sn alloy, and were considered to be advantageous to the self-lubrication property. The average tensile-shear strength of the interface was higher than 57.68 MPa at a pouring temperature of 1598 K, which fulfilled the requirements for a further extrusion process.
