What Is the Value of Water Contact Angle on Silicon?

Abstract

Silicon is a widely applied material and the wetting of silicon surface is an important phenomenon. However, contradictions in the literature appear considering the value of the water contact angle (WCA). The purpose of this study is to present a holistic experimental and theoretical approach to the WCA determination. To do this, we checked the chemical composition of the silicon (1,0,0) surface by using the X-ray photoelectron spectroscopy (XPS) method, and next this surface was purified using different cleaning methods. As it was proved that airborne hydrocarbons change a solid wetting properties the WCA values were measured in hydrocarbons atmosphere. Next, molecular dynamics (MD) simulations were performed to determine the mechanism of wetting in this atmosphere and to propose the force field parameters for silica wetting simulation. It is concluded that the best method of surface cleaning is the solvent-reinforced de Gennes method, and the WCA value of silicon covered by SiO2 layer is equal to 20.7° (at room temperature). MD simulation results show that the mechanism of pure silicon wetting is similar to that reported for graphene, and the mechanism of silicon covered by SiO2 layer wetting is similar to this observed recently for a MOF.

Keywords

• wetting
• silicon
• contact angle
• molecular dynamics simulation
• hydrocarbons hypothesis