Xi'an Gongcheng Daxue xuebao (Feb 2022)

Preparation and performance analysis of Ag/Cu conductive paste for PET thin film

  • LIAN Fuqi,
  • SU Xiaolei,
  • LIU Yi,
  • JIA Yan

DOI
https://doi.org/10.13338/j.issn.1674-649x.2022.01.006
Journal volume & issue
Vol. 36, no. 1
pp. 39 – 47

Abstract

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In view of the high price of Ag paste and easy oxidation of pure Cu paste, a series of Ag/Cu conductive paste were prepared using Ag/Cu powder as the conductive filler and polyurethane-modified acrylic resin (PUA) as a matrix. The Ag/Cu conductive coating was prepared by coating the paste on the PET thin film and finally obtained by thermal curing process. The results show that the coating presents the optimum performance when the content of Ag/Cu powder is 75%: the resistivity is 1.5×10-3 Ω·cm; the binding force between conductive coating and PET film 22.55 N. The paste also presents an excellent conductive property in the acid corrosive environment. There is no significant change after 50 times of bending, showing good corrosion and bending resistance.

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