Research on intergenerational and development of hybrid integration technology

Abstract

Hybrid integration technology is a kind of high-end packaging technology that directly encapsulates zero level devices into 1-3 level modules or systems to meet the requirements of small volume, light weight, strong function, high reliability, wide frequency, high precision and good stability for aerospace, electronic and weapon equipment. Since the 1970s, hybrid integration technology has gone through the stages from thick/thin film assembly to multi chip module(MCM), system level packaging(SIP), micro system integration and so on. It always focuses on the connection between micro-devices and macro-devices, which is a continuous innovation technology of multi-disciplinary integration for design，material，technics，project，experiment. In this paper, by analyzing and studying the process characteristics, key points and typical products of hybrid integration technology in different periods, the development of hybrid integration technology is divided into four generations by induction and summary. Meanwhile, according to the technical characteristics and trends of different generations, it also tries to predict the development direction of the next generation of hybrid integration technology.

Keywords

• hybrid integrated circuit
• hybrid integration technology
• thick/thin film
• system in package
• generations