Scientific Reports (Nov 2022)

Cleaning of LTCC, PEN, and PCB Au electrodes towards reliable electrochemical measurements

  • Mahan Hosseinzadeh Fakhr,
  • Natalia Beshchasna,
  • Sascha Balakin,
  • Ivan Lopez Carrasco,
  • Alexander Heitbrink,
  • Fabian Göhler,
  • Niels Rösch,
  • Joerg Opitz

DOI
https://doi.org/10.1038/s41598-022-23395-3
Journal volume & issue
Vol. 12, no. 1
pp. 1 – 11

Abstract

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Abstract Surface cleaning of the working electrode has a key role in improved electrochemical and physicochemical properties of the biosensors. Herein, chemical oxidation in piranha, chemical cleaning in potassium hydroxide-hydrogen peroxide, combined (electro-) chemical alkaline treatment, and potential cycling in sulfuric acid were applied to gold finish electrode surfaces deposited onto three different substrates; low temperature co-fired ceramics (LTCC), polyethylene naphthalate (PEN), and polyimide (PI), using three different deposition technologies; screen printing, inkjet printing, and electroplating (printed circuit board technology, PCB) accordingly. The effects of the (electro-) chemical treatments on the gold content and electrochemical responses of LTCC, PEN, and PCB applicable for aptamer-based sensors are discussed. In order to assess the gold surface and to compare the efficiency of the respective cleaning procedures; cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM) were employed. LTCC sensors electrochemically cycled in sulfuric acid resulted in the most gold content on the electrode surface, the lowest peak potential difference, and the highest charge transfer ability. While, for PEN, the highest elemental gold and the lowest peak-to-peak separation were achieved by a combined (electro-) chemical alkaline treatment. Gold content and electrochemical characteristics on the PCB surface with extremely thin gold layer could be slightly optimized with the chemical cleaning in KOH + H2O2. The proposed cleaning procedures might be generally applied to various kinds of Au electrodes fabricated with the same conditions comparable with those are introduced in this study.