CMP Pad Conditioning Using the High-Pressure Micro-Jet Method
Xin Li,
Yinggang Wang,
Hongyu Chen,
Wenhong Zhao,
Qianfa Deng,
Tengfei Yin,
Suet To,
Zhe Sun,
Xi Shen,
Wei Hang,
Julong Yuan
Affiliations
Xin Li
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Yinggang Wang
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Hongyu Chen
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Wenhong Zhao
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Qianfa Deng
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Tengfei Yin
State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
Suet To
State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
Zhe Sun
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Xi Shen
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Wei Hang
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Julong Yuan
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
In this study, in order to improve and restore the performance of the polishing pads and reduce the cost of chemical mechanical polishing, three types of material polishing pads, namely, polyurethane, damping cloth, and non-woven fabric, were selected for the experiment. Accordingly, each polishing pad was set up with diamond conditioner and high-pressure micro-jet (HPMJ) conditioning control experiments. Subsequently, the fluctuation ranges of the material removal rate on the three polishing pads were 2.73–3.75 μm/h, 1.38–1.99 μm/h, and 2.36–4.32 μm/h, respectively under the HPMJ conditioning method, while the fluctuation ranges of the material removal rate on the three polishing pads were 1.80–4.14 μm/h, 1.02–2.09 μm/h, and 1.78–5.88 μm/h under the diamond conditioning method. Comparing the polishing pad morphologies under SEM, we observed that the surface of the polishing pad after HPMJ conditioning was relatively clean, and the hole structure was not blocked. Contrastingly, there remained numerous abrasive particles on the surface after the conventional diamond conditioning and the hole structure was blocked. Thus, the HPMJ conditioning technology is better than the traditional diamond conditioning technology. Subsequently, the polishing pad after HPMJ conditioning has a longer service life and a more stable material removal rate than that after traditional diamond conditioning.
