ERROR COMPENSATION OF FREQUENCY INTEGRATING UNFOLDING CONVERTERS BASED ON SEMICONDUCTOR BRIDGE STRAIN CIRCUITS

Abstract

Background. The purpose of the study is to calculate the parameters of the circuit of a frequency integrating unfolding converter to compensate for the temperature error resulting from the spread of the parameters of strain gages and the effects of elevated temperature. Materials and methods. Classical methods of semiconductor physics, semiconductor strain gauge and DC and AC electrical circuits are applied to calculate the dependence of the resistance of a semiconductor strain gauge on deformation and temperature and frequency of the voltage at the output of the FIUC. Results. It is found that in order to minimize the additive and multiplicative components of the error of the FIUC output signal, it is advisable to apply an original design solution for the bridge circuit, which consists in using a strain gauge with characteristics identical to those of semiconductor strain gauges, which will reduce the additive error of the output signal by more than 7 %. Conclusions. Based on the calculations carried out, it is concluded that this design solution is the optimal means of temperature compensation when the values of semiconductor strain gages of the FIUC bridge circuit are scattered, taking into account the technological features of semiconductor strain gages.

Keywords

• error
• semiconductor strain gauge
• bridge circuit
• strain sensitivity
• fiuc