Journal of Materials Research and Technology (Nov 2023)

A novel approach to treating nickel-containing electroplating sludge by solidification with basic metallurgical solid waste

  • Xuchao Wang,
  • Chengyi Ding,
  • Hongming Long,
  • Yuxi Wu,
  • Feng Jiang,
  • Rende Chang,
  • Sheng Xue,
  • Jialong Wu,
  • Ke Cheng

Journal volume & issue
Vol. 27
pp. 3644 – 3654

Abstract

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Nickel-containing electroplating sludge is a solid waste generated during the treatment of electroplating wastewater, often managed through solidification with materials such as cement and lime. This paper presents a novel approach for solidifying nickel-containing electroplating sludge using basic metallurgical solid waste. A mathematical model was employed to determine the kinetics of Ni2+ leaching, yielding the kinetic equation α(t) = 0.97∗(1-exp (-0.19∗t)). Rapid leaching occurred in the initial 10 min, reaching a concentration of 86.78 mg/L, followed by a slower release, peaking at 104.54 mg/L within 40 min. Through the solidification of electroplating sludge with basic waste materials, it was found that the inclusion of 2.0 % lime, 12.2 % sintering dust, and 2.5 % steel slag resulted in Ni2+ leaching concentrations of 0.28, 0.41, and 0.61 mg/L, respectively, all meeting the discharge standard of <1.00 mg/L. Phase analysis indicated that the main constituents of the solidified products were C–S–H and CaSO4, with no detectable change in the crystallinity of Ni2+ before and after solidification. Thermodynamic calculations further demonstrated that under basic solidification conditions, Ni2+ transforms from NiSO4 to Ni(OH)2. Microscopic morphology analysis revealed that the encapsulation of Ni2+ by C–S–H and CaSO4 led to the densification of the porous microstructure of the electroplating sludge, achieving effective solidification.

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