A Simulation Study of Debris Removal Process in Ultrasonic Vibration Assisted Electrical Discharge Machining (EDM) of Deep Holes †

Abstract

When machining a small hole with high aspect ratio in EDM, it is hard for the flushing liquid entering the bottom gap and the debris could hardly be removed, which results in the accumulation of debris and affects the machining efficiency and machining accuracy. The assisted ultrasonic vibration can improve the removal of debris in the gap. Based on dynamics simulation software, Fluent, a three-dimensional (3D) model of debris movement in the gap flow field of EDM small hole machining assisted with side flushing and ultrasonic vibration is established in this paper. The laws of different amplitudes and frequencies and different aspect ratios on debris distribution and movement are quantitatively analyzed. The motion height of debris was observed under different conditions. The research results show that periodic ultrasonic vibration can promote the movement of debris, which is beneficial to the removal of debris in the machining gap. When compared to traditional small hole machining in EDM, the debris in the machining gap were greatly reduced, which ensures the stability of the machining process and improves the machining efficiency.

Keywords

• ultrasonic vibration assisted EDM
• debris removal process
• deep holes