Jin'gangshi yu moliao moju gongcheng (Dec 2023)
Simulation and experiment of ultrasonic-assisted grinding process for natural diamond
Abstract
To improve the surface quality of natural diamond grinding, the ultrasonic vibration was introduced for composite grinding, and an inelastic collision theory model was established to calculate the amplitude of ultrasonic vibration. The effects of ultrasonic amplitude, grinding speed and grinding grain size on the material removal of natural diamond (100) crystal surface were studied, and the optimal process parameters were sought. The results show that the ultrasonic amplitude ranges from 3.1 to 8.7 μm in the direction of easy grinding of natural diamond (110) crystal surface and 2.9 to 9.1 μm in the direction of easy grinding of natural diamond (100) crystal surface. The optimal process combination parameters of natural diamond (100) crystal surface grinding obtained by orthogonal experiment are ultrasonic amplitude of 6.0 μm, grinding disk speed of 2 800 r/min, diamond grinding grain size code of M3/6. The surface roughness Ra of diamond (100) crystal surface after ultrasonic assisted grinding is 16.21 nm, which is 63.83% lower than that of traditional mechanical grinding. Ultrasonic assisted grinding of natural diamonds can achieve better surface quality than traditional mechanical grinding.
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