Nature Communications (Mar 2024)

Monolithic back-end-of-line integration of phase change materials into foundry-manufactured silicon photonics

  • Maoliang Wei,
  • Kai Xu,
  • Bo Tang,
  • Junying Li,
  • Yiting Yun,
  • Peng Zhang,
  • Yingchun Wu,
  • Kangjian Bao,
  • Kunhao Lei,
  • Zequn Chen,
  • Hui Ma,
  • Chunlei Sun,
  • Ruonan Liu,
  • Ming Li,
  • Lan Li,
  • Hongtao Lin

DOI
https://doi.org/10.1038/s41467-024-47206-7
Journal volume & issue
Vol. 15, no. 1
pp. 1 – 9

Abstract

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Abstract Monolithic integration of novel materials without modifying the existing photonic component library is crucial to advancing heterogeneous silicon photonic integrated circuits. Here we show the introduction of a silicon nitride etch stop layer at select areas, coupled with low-loss oxide trench, enabling incorporation of functional materials without compromising foundry-verified device reliability. As an illustration, two distinct chalcogenide phase change materials (PCMs) with remarkable nonvolatile modulation capabilities, namely Sb2Se3 and Ge2Sb2Se4Te1, were monolithic back-end-of-line integrated, offering compact phase and intensity tuning units with zero-static power consumption. By employing these building blocks, the phase error of a push-pull Mach–Zehnder interferometer optical switch could be reduced with a 48% peak power consumption reduction. Mirco-ring filters with >5-bit wavelength selective intensity modulation and waveguide-based >7-bit intensity-modulation broadband attenuators could also be achieved. This foundry-compatible platform could open up the possibility of integrating other excellent optoelectronic materials into future silicon photonic process design kits.