Известия высших учебных заведений России: Радиоэлектроника (Jul 2020)

Investigation of Heat Flux Propagation in Heat-Conducting Oxide Substrates with Different Heat Conductivity by the Linear Heat Source Method

  • I. A. Vrublevsky,
  • K. V. Chernyakova,
  • E. N. Muratova,
  • N. V. Lushpa

DOI
https://doi.org/10.32603/1993-8985-2020-23-3-53-61
Journal volume & issue
Vol. 23, no. 3
pp. 53 – 61

Abstract

Read online

Introduction. For controlled thermal management of power electronics devices, an important task is to increase the efficiency of heat removal from active components. Aim. To introduce a new approach to placing a linear contact-type heat source on the surface of thin samples in order to study the features of propagation of heat fluxes in oxide substrates from materials with different thermal conductivities. Methods and materials. The paper presents the results of studies of the propagation of heat fluxes in oxide substrates with different thermal conductivity (glassceramic and aluminum oxide ceramic - polycor). To generate the heat flux, a linear heat source was used, for which an electrically conductive carbon fiber was applied. Results. Thermograms and temperature distribution profiles were obtained at different periods of heating time on the surface of the substrate with a heating element and on its reverse side. It was shown that the placement of the linear heat source, implemented using an electrically conductive carbon filament, on the surface of the studied samples and time monitoring of thermograms from two opposite surfaces of the samples allowed to obtain data for evaluating the thermal properties of oxide substrates. The distribution of the heat flux in a homogeneous material near the generation point had the form of a cone of a heat pipe with a base on the surface with a heat source. The thermal cone for an aluminum oxide ceramic substrate had a larger angle of inclination than that in the case of glassceramic. Conclusion. The results obtained allowed to propose a method for reduction of thermal resistance of a heatconducting substrate by creating conditions for increasing the area of heat-conducting section.

Keywords