APL Materials (Dec 2019)

The rise of 2D dielectrics/ferroelectrics

  • Minoru Osada,
  • Takayoshi Sasaki

DOI
https://doi.org/10.1063/1.5129447
Journal volume & issue
Vol. 7, no. 12
pp. 120902 – 120902-10

Abstract

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Ultrathin films with high-k dielectric/ferroelectric properties form the basis of modern electronics. With further miniaturization of electronic devices, conventional materials are expected to experience a challenge because of their critical thickness, where the dielectric/ferroelectric responses are unstable or even disappeared if the film thickness is reduced to the nanometer scale or below a two-dimensional (2D) limit. Owing to the benefit of preparing stable atomically thin film, 2D materials present tantalizing prospects for scaling high-k dielectric/ferroelectric technologies down to the actual atomic scale. Here, we review recent progress in 2D dielectrics/ferroelectrics and related device applications.