Increasing the adhesion laminated films based on polyimide to the surface

Abstract

Polyimide film is widely used in various fields of industry, ranging from space technology to microelectronics. The widespread use of the film is due to its high thermal stability, low dielectric constant and good mechanical strength. However, the polyimide film also has a serious disadvantage that prevents its use in a number of applications, namely, a relatively low surface energy, manifested in the low adhesive strength of the film’s compounds with other polymers and metals. Currently, a number of surface modification methods of polyimide film are known to improve adhesive properties of the surface without changing the properties of material thickness. The existing methods of polyimide film surface modification can be divided into two large groups: chemical, “wet” methods and “dry” ion-beam and plasma methods. The article presents the results of studies of polyimide adhesion changes depending on the methods of plasma treatment.