Examination of processes of heat exchange in collector thermosyphons of switching boards high degree of integration.

Abstract

The article presents the research of heat exchange and hydrodynamics of the heat transfer medium in the channels of the collector thermosyphon built into the heat load switching board. The most rational geometry of evaporation channels is chosen. Experimentally obtained dependences of the temperature of switching boards surface on the power of supplied heat flow are given. It is shown that the insertion of collector thermosiphons based on slot channels into the switching board can halve the temperature of the heat-supply zone.

Keywords

• switching board
• collector thermosyphon
• thermal mode
• equipment cooling