Active and Passive Electronic Components (Jan 1981)

Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads

  • R. Kato,
  • Y. Hiki,
  • T. Tsuge,
  • M. Nitta

DOI
https://doi.org/10.1155/APEC.8.27
Journal volume & issue
Vol. 8, no. 1-2
pp. 27 – 36

Abstract

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