Advanced Electronic Materials (Mar 2023)

In Situ/Operando Studies for Reduced Eletromigration in Ag Nanowires with Stacking Faults

  • Yu‐Hsiang Hsueh,
  • Ashok Ranjan,
  • Lian‐Ming Lyu,
  • Kai‐Yuan Hsiao,
  • Yu‐Cheng Chang,
  • Ming‐Pei Lu,
  • Ming‐Yen Lu

DOI
https://doi.org/10.1002/aelm.202201054
Journal volume & issue
Vol. 9, no. 3
pp. n/a – n/a

Abstract

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Abstract In this study, the effect of stacking faults (SFs) on electromigration in silver nanowires (AgNWs) in particular, with respect to their effects on necking and void growth, is investigated. The galvanic replacement reaction is used to synthesize the AgNWs in bulk at low cost. By varying the concentration of silver nitrate, AgNWs are obtained with and without SFs. In situ TEM analysis provides strong evidence that the SFs can effectively suppress the migration of surface atoms. Furthermore, an investigation of the void growth process reveals that SF facets parallel to the {111} plane contribute to the anisotropic change in morphology and slow down the rate of void growth by 135 times. Thus, planar defects can be beneficial to extending the lifetimes of devices by causing intrinsic changes to the material properties.

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