Micromachines (Jan 2025)

Modeling and Analysis of Vibration Coupling in Differential Common-Based MEMS Resonators

  • Jing Zhang,
  • Zhuo Yang,
  • Tianhao Wu,
  • Zhichao Yao,
  • Chen Lin,
  • Yan Su

DOI
https://doi.org/10.3390/mi16020169
Journal volume & issue
Vol. 16, no. 2
p. 169

Abstract

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In differential MEMS resonant sensors, a pair of resonators are interconnected with other structural components while sharing a common substrate. This leads to mutual coupling of vibration energy between resonators, interfering with their frequency outputs and affecting the sensor’s static performance. This paper aims to model and analyze the vibration coupling phenomena in differential common-based MEMS resonators (DCMR). A mechanical model of the DCMR structure was established and refined through finite element simulation analysis. Theoretical calculations yielded vibration coupling curves for two typical silicon resonant accelerometer (SRA) structures containing DCMR: SRA-V1 and SRA-V2, with coupling stiffness values of 2.361 × 10−4 N/m and 1.370 × 10−2 N/m, respectively. An experimental test system was constructed to characterize the vibration coupling behavior. The results provided coupling amplitude-frequency characteristic curves and coupling stiffness values (7.073 × 10−4 N/m and 1.068 × 10−2 N/m for SRA-V1 and SRA-V2, respectively) that validated the theoretical analysis and computational model. This novel approach enables effective evaluation of coupling intensity between 5resonators and provides a theoretical foundation for optimizing device structural designs.

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