Nature Communications (Jun 2023)

A heterogeneously integrated lithium niobate-on-silicon nitride photonic platform

  • Mikhail Churaev,
  • Rui Ning Wang,
  • Annina Riedhauser,
  • Viacheslav Snigirev,
  • Terence Blésin,
  • Charles Möhl,
  • Miles H. Anderson,
  • Anat Siddharth,
  • Youri Popoff,
  • Ute Drechsler,
  • Daniele Caimi,
  • Simon Hönl,
  • Johann Riemensberger,
  • Junqiu Liu,
  • Paul Seidler,
  • Tobias J. Kippenberg

DOI
https://doi.org/10.1038/s41467-023-39047-7
Journal volume & issue
Vol. 14, no. 1
pp. 1 – 9

Abstract

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Abstract The availability of thin-film lithium niobate on insulator (LNOI) and advances in processing have led to the emergence of fully integrated LiNbO3 electro-optic devices. Yet to date, LiNbO3 photonic integrated circuits have mostly been fabricated using non-standard etching techniques and partially etched waveguides, that lack the reproducibility achieved in silicon photonics. Widespread application of thin-film LiNbO3 requires a reliable solution with precise lithographic control. Here we demonstrate a heterogeneously integrated LiNbO3 photonic platform employing wafer-scale bonding of thin-film LiNbO3 to silicon nitride (Si3N4) photonic integrated circuits. The platform maintains the low propagation loss (<0.1 dB/cm) and efficient fiber-to-chip coupling (<2.5 dB per facet) of the Si3N4 waveguides and provides a link between passive Si3N4 circuits and electro-optic components with adiabatic mode converters experiencing insertion losses below 0.1 dB. Using this approach we demonstrate several key applications, thus providing a scalable, foundry-ready solution to complex LiNbO3 integrated photonic circuits.