Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

Qilong Guan; Chunjin Hang; Shengli Li; Xiaojiu Tang; Gang Yao; Dan Yu; Ying Ding; Xiuli Wang; Wei Zhang

Journal of Materials Research and Technology (Nov 2023)

Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

Qilong Guan,
Chunjin Hang,
Shengli Li,
Xiaojiu Tang,
Gang Yao,
Dan Yu,
Ying Ding,
Xiuli Wang,
Wei Zhang

Affiliations

Qilong Guan: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150006, China
Chunjin Hang: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150006, China; Zhengzhou Research Institute, Harbin Institute of Technology, Zhengzhou 450046, China; Corresponding author. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150006, China.
Shengli Li: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150006, China
Xiaojiu Tang: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150006, China
Gang Yao: Heilongjiang Institute of Atomic Energy, Harbin 150086, China
Dan Yu: Beijing Institute of Control Engineering, Beijing 100094, China
Ying Ding: Beijing Institute of Control Engineering, Beijing 100094, China
Xiuli Wang: Beijing Institute of Control Engineering, Beijing 100094, China
Wei Zhang: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150006, China; Corresponding author.

Journal volume & issue: Vol. 27
pp. 2929 – 2938

Abstract

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Eutectic SnPb ball grid array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0, 50, 100, 150 and 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties of the solder joints were investigated. After irradiation, β-Sn and Pb on the surface of the solder joint was oxidized to SnO2, PbO and PbO2, and an oxide layer covered with Cu oxide was formed on the surface of the solder joint. The formation process and mechanism of the oxide layer were analyzed. Sn and Pb depletion holes and Cu depletion areas appeared on the solder joint surfaces after various irradiation time. SnO2 nanocrystals and Sn wrinkles appeared in the FIB specimen after irradiation. After 200 h of irradiation, the melting temperature of the SnPb eutectic solder alloy decrease, and the shear force value of the solder joint first increase and then decrease.

Published in Journal of Materials Research and Technology

ISSN: 2238-7854 (Print); 2214-0697 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Mining engineering. Metallurgy
Website: https://www.journals.elsevier.com/journal-of-materials-research-and-technology/

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