Cailiao gongcheng (Aug 2016)

Effect of Interfacial Modifying on Thermo-physical Properties of SiC<sub>p</sub>/Cu Composites

  • LIU Meng,
  • BAI Shu-xin,
  • LI Shun,
  • ZHAO Xun,
  • XIONG De-gan

DOI
https://doi.org/10.11868/j.issn.1001-4381.2016.08.002
Journal volume & issue
Vol. 44, no. 8
pp. 11 – 16

Abstract

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SiCp/Cu composites were successfully fabricated by vacuum hot-pressing method. Molybdenum coating was deposited on the surface of silicon carbide by sol-gel method. The effects of the interfacial design on thermo-physical properties of SiCp/Cu composites were studied. The results indicate that:continuous and uniform MoO3 coating can be deposited on the surface of silicon carbide by peroxomolybdic acid sol-gel system, and the best processing parameters are as follows:SiC:MoO3=5:1(mass ratio), H2O2:C2H5OH=1:1(volume ratio), and surface pretreatment with acetone and hydrofluoric acid is good to the deposition and growth of MoO3 coating. After hydrogen reduction at 540℃ for 90min the MoO3 is changed into MoO2, and then hydrogen reduction at 940℃ for 90min the MoO2 is changed into Mo absolutely, and the Mo coating is continuous and uniform. SiCp/Cu composites prepared by vacuum hot-pressing method show a compact and uniform microstructure, and the thermal conductivity of the composites is increased obviously after the Mo coating interfacial modification, which can reach 214.16W·m-1·K-1 when the volume of silicon carbide is about 50%.

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