Preparation of Imidazole Compounds as Latent Curing Agents and Their Application in RGB LED Packaging

Abstract

LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for non-conductive adhesives for an imidazole curing system. The optimized composition of the adhesive is 25%wt for the curing agent and 30%wt for the silica. The prepared non-conductive adhesive has a 7-day pot life and 9-month storage stability. The shear strength reached 87 g and 72 g at 25 °C and 160 °C, respectively. The reliability of the LED modules packaged with the non-conductive adhesive was researched. The green and blue light intensity change was 4.7%, 43.7%, respectively, indicating good anti-aging properties. The blue light decay was mainly due to adhesive aging. The non-conductive adhesive effectively prevented “caterpillar” growth. This provides useful and practical guidelines for industry for applications of adhesive in different packages.

Keywords

• RGB LED
• non-conductive adhesives
• chip–substrate joint
• shear strength
• light attenuation
• reliability analysis