Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels

Abstract

High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we propose two EMC technologies including the substrate integrated packaging (SIP) and tuneable wavenumber mismatching (TWM) based on multi-functional spoof surface plasmon polariton (SSPP) channels. The SIP technology can effectively improve the EMC performance of the SSPP channels in the whole frequency band by designing the packaging structure with easy fabrication and compact size; while the TWM technology can significantly suppress crosstalks in desired frequency bands by manipulating the wavenumber difference between two adjacent channels. Simulated and measured results demonstrate excellent multi-function and EMC performance of the integrated multi-functional SSPP channels by employing the two EMC technologies. The integrated multi-functional SSPP channels can realize continuous phase modulation in X-band and continuous amplitude modulation in Ku-band. The coupling coefficient of the integrated channels is about 8–10 dB lower than that of the channels without the package, and is 13–15 dB lower than that of the traditional microstrip channels in the whole X-band and Ku-band. Meanwhile, the coupling coefficient of the integrated multi-functional SSPP channels with a distance of 1/30 λ _0 can be reduced to around −30 dB in the desired narrow bands. Therefore, the proposed EMC technologies may find broad applications in highly integrated microwave circuits and systems.

Keywords

• spoof surface plasmon polaritons (SSPPs)
• electromagnetic compatibility (EMC)
• multi-function
• substrate integrated packaging technology
• tuneable wavenumber mismatching technology