Research progress of residual stress measurement methods
Xuewen Li,
Jiwei Liu,
Hao Wu,
Kesong Miao,
He Wu,
Rengeng Li,
Chenglu Liu,
Wenbin Fang,
Guohua Fan
Affiliations
Xuewen Li
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China
Jiwei Liu
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China; The School of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, China
Hao Wu
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China
Kesong Miao
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China
He Wu
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China
Rengeng Li
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China
Chenglu Liu
Key Laboratory for Light-weight Materials, Nanjing Tech University, Nanjing, 211816, China
Wenbin Fang
The School of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, China
Residual stress refers to self-equilibrating stress present within materials, with the potential to significantly affect manufacturing processes and performance. Therefore, accurately and quantitatively measuring residual stress is always of great importance. This study provides a comprehensive review of various characterization techniques for residual stress, including their principles, development history, applications, and limitations. Initially, several destructive techniques such as the hole-drilling method, ring-core method, deep hole drilling method, slitting method, and contour method are summarized. Subsequently, three nondestructive techniques based on X-ray/electron diffraction, magnetic signals, and ultrasonic signals are evaluated. In the final part of this overview, special attention is given to a newly-developed technique for measuring residual stress, which combines incremental focused ion beam (FIB) milling and digital image correlation (DIC). Our review aims to guide further investigations on residual stress and identify the future development of techniques for measuring residual stress.
