Analysis of the presence of bonding defects on the fracture behavior of a damaged plate repaired by composite patch

Abstract

The repair technique has presented its effectiveness in the reduction of the stresses at the level of stresses concentration areas. The search for a patch and suitable adhesive for a good transfer of load has pushed researchers to develop many ideas, which relate the form, the nature, the stacking sequence of the patch and the adhesive type to give a better combination of choice between the patch and the adhesive. Our work fits in this context; the objective is to analyze by the method of finite elements the behavior in the rupture of a damaged plate in the presence of defect of bonding. The analysis of J-Integral and stresses in the tow substrates adhesive and patch shows clearly that their values depends strongly on the position of the default essentially when it�s located close to the free edge of the free edge of the adhesive or the crack.

Keywords

• J-Integral
• Adhesive defect
• Peel stress
• Shear stress