Applied Sciences (May 2023)

A Momentum Contrastive Learning Framework for Low-Data Wafer Defect Classification in Semiconductor Manufacturing

  • Yi Wang,
  • Dong Ni,
  • Zhenyu Huang

DOI
https://doi.org/10.3390/app13105894
Journal volume & issue
Vol. 13, no. 10
p. 5894

Abstract

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Wafer bin maps (WBMs) are essential test data in semiconductor manufacturing. WBM defect classification can provide critical information for the improvement of manufacturing processes and yield. Although deep-learning-based automatic defect classification models have demonstrated promising results in recent years, they require a substantial amount of labeled data for training, and manual labeling is time-consuming. Such limitations impede the practical application of existing algorithms. This study introduces a low-data defect classification algorithm based on contrastive learning. By employing momentum contrastive learning, the network extracts effective representations from large-scale unlabeled WBMs. Subsequently, a prototypical network is utilized for fine-tuning with only a minimal amount of labeled data to achieve low-data classification. Experimental results reveal that the momentum contrastive learning method improves the defect classification performance by learning feature representation from large-scale unlabeled data. The proposed method attains satisfactory classification accuracy using a limited amount of labeled data and surpasses other comparative methods in performance. This approach allows for the exploitation of information derived from large-scale unlabeled data, significantly reducing the reliance on labeled data.

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