High aspect ratio silver grid transparent electrodes using UV embossing process

Abstract

This study presents a UV embossing process to fabricate high aspect ratio silver grid transparent electrodes on a polymer film. Transparent electrodes with a high optical transmittance (93 %) and low sheet resistance (4.6 Ω/sq) were fabricated without any high temperature or vacuum processes. The strong adhesion force between the UV resin and the silver ink enables the fabrication of silver microstructures with an aspect ratio higher than 3. The high aspect ratio results in a low sheet resistance while maintaining a high optical transmittance. Multi-layer transparent electrodes were fabricated by repeating the proposed UV process. Additionally, a large-area of 8-inch touch panel was fabricated with the proposed UV process. The proposed UV process is a relatively simple and low cost process making it suitable for large-area production as well as mass production.