Reliability Examinations of SAC Lead Free Solder Material

Abstract

In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method. The solder joints were subjected to different cycle numbers up to 5000 thermal shock tests with two different thermal profiles of –30/+110°C and –40/+125°C. Microstructural properties of the tested joints were examined with the focus on intermetallic layer thickness and crack formation/propagation. Thickness of the scallop shaped Cu6Sn5 intermetallic layer was increased with increasing cycle number for both THRS and multiwave joints, but the thickening was more effective for the THRS joints. Cracks typically formed at the solder alloy/ PTH barrel and the solder alloy/pin interfaces and propagated along grain boundaries and precipitations of intermetallic compound.

Keywords

• sac
• thermal shock test
• intermetallic layer
• crack