The effect ratio of adhesive urea formaldehyde melamine formaldehyde on the properties lightweight particleboard made from expanded polystyrene

Abstract

In this study the possibility of using urea formaldehyde and melamine urea formaldehyde with different ratios of formaldehyde and melamine for manufacture lightweight particleboard by expanded polystyrene (EPS) was investigated. Experimental panels were made with 30 percent lighter that common particleboard in 25 millimeters thickness and with wood particles that had been came from a factory. Urea formaldehyde and melamine urea formaldehyde with two ratios different of melamine to urea, 40 to 60 and 20 to 80 were types of adhesive. Analysis of data and obtained averages on physical and mechanical properties indicated the best combination of EPS and used resins. Amino plastics adhesives showed good compatibility result with expanded polystyrene. As reducing of the weight of the panel was the most important target in this work, internal bonding (IB) result showed it was done. Because there was no any chemical reaction between EPS and phenolic resin as adhesive, it’s using was unsuccessful. Preliminary results especially internal bonding and physical properties revealed this lightweight panel is proper for defined applications. Furthermore, using melamine urea formaldehyde as adhesive was positive effects on IB and the highest IB was for the panel made with this resin and minimum EPS content. In comparison of common panels, this new panel with maximum melamine content and hydrophobic EPS showed better results on IB and physical properties.

Keywords

• Lightweight Particleboard
• Expanded Polystyrene
• Adhesive Type
• PHYSICAL AND MECHANICAL PROPERTIES