Nanotechnology Reviews (Aug 2024)

Computational analysis of water-based silver, copper, and alumina hybrid nanoparticles over a stretchable sheet embedded in a porous medium with thermophoretic particle deposition effects

  • Karthik Kalachar,
  • Saadeh Rania,
  • Kumar Ravikumar Shashikala Varun,
  • Qazza Ahmad,
  • Madhukesh Javali Kotresh,
  • Khan Umair,
  • Ishak Anuar,
  • Siddiqui Md Irfanul Haque

DOI
https://doi.org/10.1515/ntrev-2024-0083
Journal volume & issue
Vol. 13, no. 1
pp. 2450361 – 18

Abstract

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The present study scrutinizes the significance of heat source/sink (HSS), thermophoretic particle deposition, and porous media on the time-dependent ternary nanofluid stream across a stretchable surface in the presence of Newtonian heating (NH) and common wall temperature (CWT) cases. The governing equations of the investigated model are changed into ordinary differential equations by using suitable similarity transformations. The resultant dimensionless equations are solved using the Laguerre polynomial collocation method. For comparison, the Runge Kutta Fehlberg’s fourth-fifth order (RKF-45) method is employed. Graphs are used to illustrate the significant parameters’ impacts on each profile, and relevant physical quantities such as the Sherwood number, skin friction, and Nusselt number are exhibited. The study reveals that the velocity profile drops with an increase in permeable parameters. The thermal profile increases with improvement in porous and HSS constraints. The concentration diminishes as the value of the thermophoretic parameter rises. For better solid volume fraction values, the rate of temperature dispersal is lower in the NH case associated with the CWT case. Additionally, the rate of thermal distribution is enhanced by approximately 2.90% surface drag force, 4.73% in the CWT case and 2.27% in the NH case, and the rate of mass transfer is enhanced by 2.99% when transitioning from ternary the ternary hybrid nanofluid to the (normal) nanofluid. The results of the study will help in heat exchangers, thermal management, chemical engineering, biomedical instruments, and design and optimization of electronic equipment.

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