Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment

Abstract

The effects of high-density electric current pulse (ECP) treatment on the solidification of Cu–37.4 wt% Pb monotectic alloy melt were investigated. Compared to the method of molten glass purification combined with cyclic superheating, ECP treatment created finer microstructures of Cu–Pb alloys, with more homogeneous distribution of the Pb phase in the matrix. This phenomenon can be explained by the cluster theory for liquid metals and the non-equilibrium diffusion theory. First, ECP treatment could cause the fission of larger atomic clusters to increase the undercooling that enabled a large number of smaller clusters to grow and reach the critical nucleation radius. Second, ECP treatment could reduce the diffusion energy barrier to enhance the non-equilibrium diffusion of solute atoms and suppress the segregation of Pb.

Keywords

• electric current pulse
• undercooling
• grain refinement
• solidification structure
• cu–37.4 wt% pb alloy