Theory and practice of vibration analysis in electronic packages

Abstract

The paper represents theoretical and experimental vibration analysis of electronic packages. The research objectives are bearing parts, such as printed circuit boards, walls of the cases and electronic components, in enclosed electronic packages subjected to vibration during their operation. The theoretical model of the oscillation system representing electronic package installed on the support subjected to vibration is described. Vibration transmission from the shaker to the tested electronic package is explained as the complex problem to solve. The experimental measurement verified significant difference in amplitudes of vibrations transmitted inside the package and incident to. The elements of plate bending theory is used for main boards, case walls and other planar rectangular structures considered as equivalent homogeneous plates, in order to estimate their natural frequencies and forms of free cross oscillations and hence to identify their possible resonances with purpose to avoid them in operation. The significant attention was paid to the experimental research of dynamic characteristics, representing results in form of Chladni figures and amplitude frequency responses.