Effects of Short-Term Exposure of Chloramine-T Solution on the Characteristics of Light-Cured and Chemical-Cured Adhesives

Abstract

This study evaluated the effect of a 0.5% chloramine T solution on a chemical-cured universal adhesive by comparing the light-cured, one-step, self-etch adhesive for the bonding performance, mechanical properties, and resin–dentin interfacial characteristics. Caries-free human molars were randomly assigned into eight groups based on the bonding systems employed (Bond Force II, BF and Bondmer Lightless, BL), the immersion solutions used before bonding (0.5% chloramine T solution and distilled water), and the immersion durations (5 and 60 min). Microtensile bond strength (μTBS), nanoleakage evaluation, and nanoindentation tests were performed, and the surface morphology of the resin–dentin interface was examined using a focus ion beam/scanning ion microscopy system. Immersion in chloramine-T for 5 min significantly decreased the μTBS of Bondmer Lightless (from 22.62 to 12.87 MPa) compared with that in distilled water. Moreover, there was also a decreasing trend after immersing in chloramine-T for 60 min (from 19.11 to 13.93 MPa). Chloramine T was found to have no effect on the hardness, elastic modulus, or morphological characteristics of the ion-beam milled resin–dentin interfacial surfaces in the tested adhesives, suggesting that chloramine T might reduce the bond strength by interfering with the interaction and the sealing between the adhesive resin and dentin in the chemical-cured universal adhesive, albeit without affecting the mechanical properties.

Keywords

• microtensile bond strength
• bonding performance
• nanoleakage
• FIB-SIM
• mechanical properties
• interfacial characteristics