Nature Communications (Jun 2016)

Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications

  • Wei-Jin Li,
  • Juan Liu,
  • Zhi-Hua Sun,
  • Tian-Fu Liu,
  • Jian Lü,
  • Shui-Ying Gao,
  • Chao He,
  • Rong Cao,
  • Jun-Hua Luo

DOI
https://doi.org/10.1038/ncomms11830
Journal volume & issue
Vol. 7, no. 1
pp. 1 – 8

Abstract

Read online

The integration of porous metal-organic frameworks into devices for electronic applications is in its infancy. Here, the authors deposit metal-organic framework films onto conductive metal plate electrodes, and show that the resulting films exhibit enhanced dielectric properties.