AIP Advances (Apr 2016)

Thermoelectric properties of In-rich InGaN and InN/InGaN superlattices

  • James (Zi-Jian) Ju,
  • Bo Sun,
  • Georg Haunschild,
  • Bernhard Loitsch,
  • Benedikt Stoib,
  • Martin S. Brandt,
  • Martin Stutzmann,
  • Yee Kan Koh,
  • Gregor Koblmüller

DOI
https://doi.org/10.1063/1.4948446
Journal volume & issue
Vol. 6, no. 4
pp. 045216 – 045216-9

Abstract

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The thermoelectric properties of n-type InGaN alloys with high In-content and InN/InGaN thin film superlattices (SL) grown by molecular beam epitaxy are investigated. Room-temperature measurements of the thermoelectric properties reveal that an increasing Ga-content in ternary InGaN alloys (0 < x(Ga) < 0.2) yields a more than 10-fold reduction in thermal conductivity (κ) without deteriorating electrical conductivity (σ), while the Seebeck coefficient (S) increases slightly due to a widening band gap compared to binary InN. Employing InN/InGaN SLs (x(Ga) = 0.1) with different periods, we demonstrate that confinement effects strongly enhance electron mobility with values as high as ∼820 cm2/V s at an electron density ne of ∼5×1019 cm−3, leading to an exceptionally high σ of ∼5400 (Ωcm)−1. Simultaneously, in very short-period SL structures S becomes decoupled from ne, κ is further reduced below the alloy limit (κ < 9 W/m-K), and the power factor increases to 2.5×10−4 W/m-K2 by more than a factor of 5 as compared to In-rich InGaN alloys. These findings demonstrate that quantum confinement in group-III nitride-based superlattices facilitates improvements of thermoelectric properties over bulk-like ternary nitride alloys.