Development of a Simple Electroless Method for Depositing Metallic Pt-Pd Nanoparticles over Wire Gauge Support for Removal of Hydrogen in a Nuclear Reactor
Kiran K. Sanap,
Sawanta S. Mali,
Deepak Tyagi,
Ajit N. Shirsat,
Suhas B. Phapale,
Suresh B. Waghmode,
Salil Varma
Affiliations
Kiran K. Sanap
Shri Guru Gobind Singhji Institute of Engineering and Technology, Nanded 431606, India
Sawanta S. Mali
Polymer Energy Materials Laboratory, School of Chemical Engineering, Chonnam National University, Gwangju 61186, Republic of Korea
Deepak Tyagi
Chemistry Division, Bhabha Atomic Research Centre, Trombay, Mumbai 400085, India
Ajit N. Shirsat
Chemistry Division, Bhabha Atomic Research Centre, Trombay, Mumbai 400085, India
Suhas B. Phapale
Chemistry Division, Bhabha Atomic Research Centre, Trombay, Mumbai 400085, India
Suresh B. Waghmode
Department of Chemistry, Savitribai Phule Pune University, Pune 411007, India
Salil Varma
Chemistry Division, Bhabha Atomic Research Centre, Trombay, Mumbai 400085, India
Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl2 + PdCl2 seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H2 and O2 recombination reactions for hydrogen mitigation applications in nuclear reactors.
