Study of Metal Leaching from Printed Circuit Boards by Improved Electrochemical Hydrochlorination Technique Using Alternating Current
Vera Serga,
Aleksej Zarkov,
Andrei Shishkin,
Edgars Elsts,
Maksims Melnichuks,
Mikhail Maiorov,
Ervins Blumbergs,
Vladimir Pankratov
Affiliations
Vera Serga
Institute of Materials and Surface Engineering, Faculty of Materials Science and Applied Chemistry, Riga Technical University, 3/7 P. Valdena Street, LV-1048 Riga, Latvia
Aleksej Zarkov
Institute of Solid State Physics, University of Latvia, 8 Kengaraga Street., LV-1063 Riga, Latvia
Andrei Shishkin
ZTF Aerkom SIA, 32 Miera Steet., Salaspils nov., LV-2169 Salaspils, Latvia
Edgars Elsts
Institute of Solid State Physics, University of Latvia, 8 Kengaraga Street., LV-1063 Riga, Latvia
Maksims Melnichuks
Institute of Materials and Surface Engineering, Faculty of Materials Science and Applied Chemistry, Riga Technical University, 3/7 P. Valdena Street, LV-1048 Riga, Latvia
Mikhail Maiorov
Institute of Physics, University of Latvia, 32 Miera Street, LV-2169 Salaspils, Latvia
Ervins Blumbergs
ZTF Aerkom SIA, 32 Miera Steet., Salaspils nov., LV-2169 Salaspils, Latvia
Vladimir Pankratov
Institute of Solid State Physics, University of Latvia, 8 Kengaraga Street., LV-1063 Riga, Latvia
This paper presents the results of the leaching of metals from computer PCBs by electrochemical hydrochlorination using alternating current (AC) with an industrial frequency (50 Hz). Leaching was carried out with a disintegrator-crushed computer motherboard with a particle size (d) of HCl = 6 mol·L−1, i = 0.80 A·cm−2, S/L = 8.6 g·L−1), is reached after 1.5 h, and that of Cu and Ni is reached after 2 h from the beginning of the experiment. At the same time, the degree of leaching of other metals after 2 h is Co-78.8%, Cr-84.4%, Sb-91.7%, Fe-98.9%, V-98.1% and Pb-5.1%. The paper also reports the results on the leaching of all abovementioned metals, as well as Ag and Pd, with disintegrator-crushed mixed computer PCBs with d < 90 μm and loading option 1.