The Effect of Co Content and Annealing Temperatures on the Resistivity in Ag-Co Films

Yuanjiang Lv; Haoliang Sun; Pengyan Shi; Xinxin Lian; Haoge Zhang; Saibo Li; Shihao Liang; Guangxin Wang; Fei Ma

doi:10.3390/nano12132297

Nanomaterials (Jul 2022)

The Effect of Co Content and Annealing Temperatures on the Resistivity in Ag-Co Films

Yuanjiang Lv,
Haoliang Sun,
Pengyan Shi,
Xinxin Lian,
Haoge Zhang,
Saibo Li,
Shihao Liang,
Guangxin Wang,
Fei Ma

Affiliations

Yuanjiang Lv: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Haoliang Sun: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Pengyan Shi: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Xinxin Lian: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Haoge Zhang: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Saibo Li: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Shihao Liang: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Guangxin Wang: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Fei Ma: School of Materials Science and Engineering, Xi’an Jiaotong University, Xi’an 710049, China

DOI: https://doi.org/10.3390/nano12132297
Journal volume & issue: Vol. 12, no. 13
p. 2297

Abstract

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Ag-Co films with ultra-high resistivity were prepared on polyimide by magnetron sputtering. The effect of Co content and annealing temperatures on the resistivity and microstructure of Ag-Co films has been thoroughly investigated and the relation between resistivity and microstructure has been discussed. Results show that thicker Ag-Co films without annealing present lower resistivity due to better crystallinity. However, thin Ag-Co films (≤21 nm) annealed at 360 °C present ultra-high film resistivity because of the formation of diffusion pits on the film surface which blocks the transmission of electrons in films to increase film resistivity. Inversely, the resistivity of thick Ag-Co films (≥45 nm) annealed at 360 °C is much less than that annealed at lower than 260 °C owing to no diffusion pits. Furthermore, the addition of Co inhibits the growth of Ag grains and limits the migration of electrons in Ag-Co films further, also resulting in the increase of Ag-Co films’ resistivity.

Published in Nanomaterials

ISSN: 2079-4991 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Science: Chemistry
Website: https://www.mdpi.com/journal/nanomaterials

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