Российский технологический журнал (Mar 2021)
LPKF-LDS technology for the production of three-dimensional schemes on plastics
Abstract
A promising technology for the production of three-dimensional circuits on plastics, the scope of its current application and prospects for its further development in the radio-electronic industry are considered. The analysis of current opportunities and limitations is carried out. It is shown that the key component of the technology is the correct choice of thermoplastics with suitable characteristics for the intended object, taking into account the resistance to external factors. An analysis of the international and domestic regulatory framework for thermoplastics was conducted. This allowed to determine the key characteristics for 3D-MID-technology and to make a comparison. A classification is proposed on the basis of the key characteristics of thermoplastics for making a decision when choosing materials on the market, taking into account the application in the radio-electronic industry using 3D-MID technology, which is currently either absent or not fully represented. Methods of testing materials for use in the production technology of three-dimensional circuits on plastics and ensuring the quality of manufacturing of radio engineering products, allowing to confirm the compliance of key parameters of materials are studied. The article considers the order of the build process with the application of the LPKF-LDS technology production of three-dimensional circuits on plastics, which allows building a sequence of processes with particular implementation as an example. The considered LPKF-LDS technology as part of the 3D-MID line is planned in the new laboratory “Threedimensional circuits on plastics and flexible media” at the Department of Design and Production of Radioelectronic Devices of the Institute of Radio Engineering and Telecommunications Systems of MIREA – Russian Technological University.
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