Direct Current Sputtering Deposition of the Metallic Ceramic Ti3SiC2 Thin Film with Improved Hydrophobicity and Reduced Surface Energy

Abstract

Metallic ceramic compounds, such as Ti3SiC2, are innovative materials that combine the properties of metals and ceramics. However, most methods used in synthesizing these materials employ high deposition temperatures. Hence, in this work, Ti3SiC2 thin film was prepared and deposited on a steel sample without heating or biasing using a magnetized sheet plasma source. The synthesis was carried out by sputtering titanium, silicon, and graphite targets with Ar plasma at different deposition times of 60, 90, and 120 minutes. Energy dispersive X-ray (EDX) and X-ray diffraction (XRD) scans of the samples confirmed the synthesis of the desired compound. Moreover, the wettability and surface energy properties of the coated substrate were calculated by contact angle measurements. Results showed that as the deposition time increased, the coated substrate became more hydrophobic. Indeed, these findings show that Ti3SiC2 deposited steel substrate, with its increased hydrophobicity, is a potential self-cleaning coating for industrial tools.

Keywords

• contact angle
• max phase
• sputtering
• surface energy
• titanium silicon carbide