Journal of Materials Research and Technology (Mar 2023)

Electrochemical behavior of ECAP-processed Sn–5Sb alloy

  • S. Alipour,
  • H. Vafaeenezhad,
  • M. Fesahat,
  • A. Yazdi,
  • S.M. Mousavi-Khoshdel,
  • M. Soltanieh

Journal volume & issue
Vol. 23
pp. 5193 – 5211

Abstract

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An attempt has been made in this research to evaluate the effects of severe plastic deformation (SPD) on the electrochemical and passivation response of Sn–5Sb alloy. The electrochemical response of severely deformed alloy through the equal channel angular pressing (ECAP) process has been studied by cyclic voltammetry (CV), potentiodynamic polarization (PDP), electrochemical impedance spectroscopy (EIS), and Mott–Schottky in 0.1 M NaOH solution. The grain structure and corrosion product of samples have been evaluated by X-ray diffraction (XRD), atomic force microscopy (AFM) patterns, transmission electron microscopy (TEM), and field emission scanning electron (FESEM) micrographs. It has been revealed that imposing such a large strain yields specimens with finer grain structure resulting in higher corrosion resistance and higher protecting passive films.

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