Nature Communications (Jun 2017)
Self-assembled three dimensional network designs for soft electronics
- Kyung-In Jang,
- Kan Li,
- Ha Uk Chung,
- Sheng Xu,
- Han Na Jung,
- Yiyuan Yang,
- Jean Won Kwak,
- Han Hee Jung,
- Juwon Song,
- Ce Yang,
- Ao Wang,
- Zhuangjian Liu,
- Jong Yoon Lee,
- Bong Hoon Kim,
- Jae-Hwan Kim,
- Jungyup Lee,
- Yongjoon Yu,
- Bum Jun Kim,
- Hokyung Jang,
- Ki Jun Yu,
- Jeonghyun Kim,
- Jung Woo Lee,
- Jae-Woong Jeong,
- Young Min Song,
- Yonggang Huang,
- Yihui Zhang,
- John A. Rogers
Affiliations
- Kyung-In Jang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Kan Li
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University
- Ha Uk Chung
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Sheng Xu
- Department of NanoEngineering, University of California at San Diego
- Han Na Jung
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Yiyuan Yang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Jean Won Kwak
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Han Hee Jung
- Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST)
- Juwon Song
- Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST)
- Ce Yang
- Department of Engineering Mechanics, Center for Mechanics and Materials, AML, Tsinghua University
- Ao Wang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University
- Zhuangjian Liu
- Institute of High Performance Computing
- Jong Yoon Lee
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Bong Hoon Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Jae-Hwan Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Jungyup Lee
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Yongjoon Yu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Bum Jun Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Hokyung Jang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
- Ki Jun Yu
- School of Electrical and Electronic Engineering, Yonsei University
- Jeonghyun Kim
- Department of Electronics Convergence Engineering, Kwangwoon University
- Jung Woo Lee
- Department of Materials Science and Engineering, Pusan National University
- Jae-Woong Jeong
- Department of Electrical, Computer and Energy Engineering, University of Colorado
- Young Min Song
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology
- Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University
- Yihui Zhang
- Department of Engineering Mechanics, Center for Mechanics and Materials, AML, Tsinghua University
- John A. Rogers
- Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for BioNanotechnology, McCormick School of Engineering and Feinberg School of Medicine, Northwestern University
- DOI
- https://doi.org/10.1038/ncomms15894
- Journal volume & issue
-
Vol. 8,
no. 1
pp. 1 – 10
Abstract
Many low modulus systems, such as sensors, circuits and radios, are in 2D formats that interface with soft human tissue in order to form health monitors or bioelectronic therapeutics. Here the authors produce 3D architectures, which bypass engineering constraints and performance limitations experienced by their 2D counterparts.
